Keysight and WIN aim to cut costly GaN chip respins before fabrication

Category: Markets

Published: 2026-06-30T14:59:59.000Z

Keysight Technologies and WIN Semiconductors have collaborated to create a new GaN MMIC design workflow. This workflow aims to reduce design risks and achieve first-pass tapeout success for high-frequency RF components, preventing costly respins. The solution integrates on-chip simulation, 3D layout, and off-chip evaluation board design, supported by WIN's latest NP 120P GaN Process Design Kit within Keysight's design tools.

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